IC (Integrated Circuit) तकनीक हिंदी में
"एकीकृत परिपत्र तकनीक" कहलाती है। यह एक इलेक्ट्रॉनिक तकनीक है जिसमें कई ट्रांजिस्टर,
रेजिस्टर और कैपेसिटर को एक ही सिलिकॉन चिप में एकीकृत किया जाता है। IC तकनीक द्वारा यह संभव होता है कि बहुत सारे इलेक्ट्रॉनिक
कंपोनेंट को एक साथ मिलाकर बनाए जाएं, जिससे कंप्यूटर, मोबाइल फोन, टेलीविजन, रेडियो और अन्य इलेक्ट्रॉनिक उपकरण निर्माण किए जा सकते हैं।
Integrated Circuit
(IC) technology refers to the design, manufacturing, and fabrication processes
involved in creating integrated circuits. Integrated circuits are miniature
electronic devices that contain multiple electronic components, such as
transistors, resistors, capacitors, and diodes, on a single semiconductor
substrate.
Here are the key aspects of IC technology:
1. Design: IC design involves creating a schematic or a
layout representation of the desired circuit. Designers use electronic design
automation (EDA) software to design and simulate the circuit's functionality
and performance.
2. Semiconductor Fabrication: The fabrication process starts with the preparation of the semiconductor wafer, usually made of silicon. It involves several steps, including cleaning the wafer, creating an oxide layer, doping to modify its electrical properties, and depositing various materials to form the different layers of the circuit.
3. Photolithography:
Photolithography is a
crucial step in IC fabrication. It uses light-sensitive photoresist materials
and masks to transfer the desired circuit pattern onto the wafer. Ultraviolet
light exposure and chemical processes selectively remove or protect areas of
the wafer, defining the circuitry.
4.
Et ching: Etching processes remove or modify materials
to create the desired circuit patterns. This can be done through wet etching,
where chemicals selectively remove specific layers, or dry etching, such as
plasma etching, which uses reactive gases to etch the materials.
5. Deposition: Deposition techniques are employed to add
thin films of materials onto the wafer. These films can be conductive,
insulating, or semiconducting, and they are deposited using methods like
physical vapor deposition (PVD) or chemical vapor deposition (CVD).
6. Metallization: Metallization involves depositing metal
layers, typically aluminum or copper, to form interconnections between different
components of the integrated circuit. These metal layers are patterned and
etched to create the desired wiring pattern.
7. Testing
and Packaging: After fabrication,
the ICs undergo testing to ensure they meet quality standards and functional
specifications. Once tested, the individual ICs are packaged to protect them
and provide electrical connections to external devices. Packaging can range
from simple through-hole packages to more advanced surface mount technology
(SMT) packages.
IC
technology has revolutionized
the electronics industry by enabling the production of smaller, faster, and
more efficient electronic devices. It has driven advancements in computing,
telecommunications, consumer electronics, automotive systems, and numerous
other fields. The continuous development of IC technology has led to increased
device integration, improved performance, and reduced power consumption in
modern electronic devices.